tech forum 2026 | Munich
Design Offices München Macherei (Weihenstephaner Str. 12 , D-81673 Munich)
On 4–5 February, Tech Forum 2026 will take place in Munich — and tde will be exhibiting there
As a Premium Partner, we will be on site and look forward to welcoming you personally at our booth. Together with you, we want to dive into the world of our innovations and show you how our tML®24+ Plug-&-Play cabling system for the Smart Rack is setting new standards.
Our tML24+ for the Smart Rack is the first cabling platform that uses the new, revolutionary MMC 24-fibre connector both in the rear and in the patch area. Combined with our modular tML system platform, it enables twice the packing efficiency and offers simple migration options — currently up to 800G.
What awaits you at our booth at Tech Forum 2026 in Munich
Insights into our latest developments in multi-fibre technology, including these highlights:
• The innovative tML®24+ for the Smart Rack
• The compact and high-performance MMC connector
• Our newly designed tML splice module for up to 192 fibre splices in 1 RU
• Our latest highlight: the tML Reverse Module – identical port density in the rear and patch area
An exclusive expert presentation showing how to prepare your data centres efficiently, flexibly and future-proof for rising data rates and cabling requirements using the Smart Rack.
Join us and let’s talk about the future of cabling, multi-fibre and parallel optics technology!
Meet us in Munich, where leading experts in cabling, networks and infrastructure will gather for two days — with exciting specialist presentations, inspiring discussions, product innovations and plenty of room for networking.
Register now for free — with tde’s VIP code
TFM26TDE
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