Dortmund/Germany, 18. January 2022. tde - trans data elektronik is the first network expert to provide a fibre optic SN module for its successful tML-Standard, tML24 and tML-Xtended cabling platforms. For this purpose, tde has integrated the compact SN connector from Senko into its tML system platform. The result: with 384 fibres on one height unit in the patch area, the packing density is doubled compared to LC duplex connectors. Companies and network engineers thus save valuable space in data centres. In the rear area, the new module relies on the proven MPO technology with plug-and-play functionality.
Dortmund/Germany, 21 September 2021. The network specialist tde – trans data elektronik has fundamentally redesigned its 19-inch tML rack mount enclosure for fixed installation: the new model not only has a modern design, but also offers improved functionality. The tML rack mount enclosure has a capacity of up to eight modules from the tML-Standard, tML-Xtended, tML-24 and tML-32 product ranges. When fully equipped, it offers space on a 19-inch height unit for 96x fibre optic LC duplex ports with 192 fibres, 96x 12-fibre MPOs with 1152 fibres or 96x 24-fibre MPOs with 2304 fibres. In combination with the fibre optic MDC module, the rack mount enclosure achieves a doubling of the packing density compared to LC duplex and, in combination with the innovative tML-24, offers the industry's highest packing density and greatest flexibility when migrating to high transmission rates.
Dortmund/Germany, June 21st, 2021. tde celebrates its 30th anniversary. Since 1991, the network specialist has been developing and producing scalable cabling systems for the industry's highest packing densities. In doing so, the company consistently focuses on sustainability and quality in all areas: from the conception to the supply chain through to the production of its energy-efficient and investment-safe cabling systems at its German production site. Customers thus benefit from stable and future-proof networks with 100 percent reliability and high availability. The technology leader in MPO multi-fibre technology is also pursuing the concept of sustainability for its company buildings: After moving into its heritage-listed sales office in Dortmund five years ago, tde puts its new core-renovated ultramodern production hall into operation at the site in Bippen/Ohrte in its anniversary year, thus living up to its approach of "creating, maintaining and increasing values".
Dortmund/Germany, April 22nd, 2021. tde - trans data elektronik GmbH is further expanding its tPM concept and adding two new components to its successful patch cable management system: As of now, network technicians have at their disposal a 19-inch panel on a height unit (RU) with two integrated cable bushings as well as vertical panel for vertical patch cable management. In combination with the modular cabling platforms tML, tSML and tBL, customers benefit from cleanly structured and energy-efficient cabling with the highest packing densities in a compact space.
Dortmund/Germany, 24th February 2021. tde - trans data elektronik GmbH has integrated the popular small computer Raspberry Pi into its modular cabling platform tML. For this purpose, the network expert has designed a stable housing made of stainless steel sheet that corresponds to the dimensions of the tML standard housing. Thanks to a thought-out connection and cable design, up to eight tML Raspberry Pi modules can be accommodated on a 19-inch unit (U) or alternatively on the DIN rail module by means of a tML DIN rail module adapter. Thanks to the modular concept of the tML system platform, network technicians can for the first time combine or mix passive (TP and fibre-optic modules) and active network components (Raspberry Pi modules). This allows applications in industrial and building automation to be realised in a very space-saving manner and significantly increases the packing efficiency in the network cabinet.
Dortmund/Germany, February 1st, 2021. tde, Senko and the Prysmian Group, BU Multimedia Solutions (MMS) will be demonstrating how to create a fast, future-proof and highly available communications cabling system with 100 percent reliability and thus a stable backbone for every company network. On February 10th at 10 a.m., network specialist tde, component partner Senko and cable expert BU MMS invite interested parties to a webcast entitled "Cabling in the Data Center – Efficient by Design" as part of the NTT Technology Experience Lab. In their presentations, the technology partners will provide information on high-density solutions in data centres, explain the advantages of structured cabling and answer questions on the topics of high availability, reliability and energy efficiency. Interested parties can register now free of charge at https://www.brighttalk.com/webcast/15381/464444 and view the agenda.
Dortmund/Germany, November 10th 2020. tde - trans data elektronik GmbH is the first network manufacturer to make its successful tML-standard, tML24 and tML-Xtended cabling systems available with fibre optic MDC modules with immediate effect: By integrating the compact MDC connector from US Conec into the system platform, the packing density with 384 fibres per unit height in the patch area is doubled compared to LC duplex connectors. This saves valuable space in data centres. In the rear area, the new module integrates the proven MPO technology with plug-and-play functionality. Customers can easily replace and update their existing tML systems with LC duplex modules with MDC modules. This gives them the industry's highest packing density with single-fibre connectors and allows them to benefit from high-density applications that are a safe investment, future-proof high-speed networks with transmissions of up to 400G and greater energy efficiency in the patch area.
Dortmund/Germany, September 23nd, 2020. tde - trans data elektronik GmbH is expanding its successful modular central office solution tDF to include a pure fibre optic splice module. Network engineers can use it to splice through up to 24x optical fibres. A unique feature in the industry is the over length management system integrated into the splice module. While conventional solutions require an additional height unit for the overlength tray, network engineers and companies save rack space by using the tDF fibre optic splice modules. The ODF solution scores with its high packing density: Up to 288 splices can be stored in a tDF 19-inch module with three height units. Thereby, the tDF rack system holds up to 4032 splices in 46 height units.
Dortmund/Germany, 31st August 2020. tde - trans data elektronik GmbH is launching a new modular 19-inch fibre optic splice enclosure specifically for its tBL - tde Basic Link product range. Originally developed for a major telecom carrier, the enclosure is suitable for splice and breakout applications. For easy handling, the network expert has designed the drawer to be pulled out, swung down and removed. Network engineers can lock and unlock it without tools using a mechanism developed by tde. The special feature: In addition to the closed chassis version, the enclosure is also available as a ventilated lattice enclosure version, thus improving air circulation in the distribution cabinet.
Dortmund, 28. July 2020. tde - trans data elektronik GmbH and US Conec are strengthening their strategic partnership and offering companies future-proof cabling infrastructures with high packing density for transmissions of up to 400G: to this end, network expert tde has integrated US Conec's compact MDC connector into its successful tML system platform. In the rear area, the cabling platform continues to rely on the proven MPO technology based on the plug-and-play principle. In the patch area it integrates the MDC connector with two fibres. This allows a total of 384 fibres to be terminated on one height unit. This doubles the packing density compared to conventional LC duplex connectors. The new solution provides customers with the highest packing density in the industry with single fibre connectors for high-density applications that are a safe investment.
